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Explore David Lam, Lam Research | CASPA CEO Summit 2026 with 10,908 views, 132 likes, and 0 comments. Experience the impact of this video content that has captured audience attention.

In this interview from The CEO Summit 2026, hosted by CASPA, David Lam, founder of Lam Research Corp. and chief executive officer of Multibeam Corp., joins theCUBE's John Furrier and Dave Vellante to discuss the semiconductor industry's pivot from Moore's Law to advanced packaging as the next engine of innovation. Lam reflects on CASPA's 35-year evolution from a handful of engineers into a vital hub connecting chip designers, foundries and equipment makers. He details how Multibeam's maskless electron-beam lithography shrinks massive writing columns down to pen-sized arrays, enabling reticle-free manufacturing for oversized quantum and AI chips. Lam also notes Multibeam's $140 million CHIPS Act award, which supports energy-efficient, co-packaged optics manufacturing for power-constrained AI data centers. The conversation also explores how the end of Moore's Law has opened a "Wild West" moment for the industry, where new rules and new entrants finally have room to compete. Lam explains why Multibeam deliberately supports wafer sizes from 300mm down to 100mm, giving startups and entrepreneurs a path to prove emerging technologies before scaling. He describes a rare cultural shift in semiconductors, where veteran engineers and young innovators are collaborating rather than competing, pairing fresh ideas with decades of manufacturing experience. From quantum computing's oversized chip demands to the energy efficiency challenges reshaping data center design, Lam offers a candid look at where the next wave of semiconductor breakthroughs will come from. Find more SiliconANGLE news and analysis https://siliconangle.com/ Follow theCUBE's wall-to-wall event coverage https://siliconangle.com/events/ Learn about the latest theCUBE events https://www.thecube.net/ 00:00 - CASPA's Role in Semiconductor Industry Collaboration 02:41 - Advanced Chip Manufacturing Beyond Moore's Law 10:11 - Semiconductor Startup Opportunities in AI Efficiency 13:57 - Supporting Semiconductor Innovators and Entrepreneurs #theCUBE #CASPA #theCUBEresearch #NYSEWired #Semiconductors #AIInfrastructure #Multibeam

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