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Explore Nisha Ananthakrishnan, Patricia MacLeod & Tazrien Kamal | GSA Women's Leadership Initiative 2026 with 9,645 views, 121 likes, and 0 comments. Experience the impact of this video content that has captured audience attention.

In this interview from GSA Women’s Leadership Initiative 2026, Nisha Ananthakrishnan, senior director of advanced packaging at Intel, joins Patricia MacLeod, senior director of corporate communications and industry partnerships at Advanced Semiconductor Engineering (ASE), and Tazrien Kamal, senior director of technology and innovation at GlobalFoundries, to talk with theCUBE's John Furrier and Alison Kosik about how advanced packaging has evolved from an afterthought into the architecture that defines AI system performance. Ananthakrishnan explains how chiplets now give architects a new dimension of flexibility, letting compute, memory and I/O be optimized separately and reassembled through technologies like Intel's EMIB. Kamal notes that mature-node chips for power management and sensing remain just as critical as leading-edge processors. MacLeod details how ASE's integrated design ecosystem pulls partners in earlier, since silicon, memory, thermal and power decisions can no longer be optimized in isolation. The conversation also explores the engineering complexity of bringing high-bandwidth memory, logic and I/O together in a single package, where fixing one variable often creates new thermal or reliability challenges elsewhere. MacLeod points to standards like UCIe as a strong starting point, while stressing the need for common approaches to known-good-die testing and reusable chiplet IP. Kamal highlights emerging non-digital technologies — from optical interconnects to quantum computing — as the next frontier for AI data centers, and Ananthakrishnan frames thermal management as a persistent but solvable challenge rather than a hard limit. MacLeod closes by outlining the multidisciplinary skill set the industry now demands, blending electrical engineering, materials science and thermal design with AI-driven simulation, as the panel makes clear that packaging has become the proving ground for the next generation of semiconductor leadership. Find more SiliconANGLE news and analysis https://siliconangle.com/ Follow theCUBE's wall-to-wall event coverage https://siliconangle.com/events/ Learn about the latest theCUBE events https://www.thecube.net/ 00:00 - Intro 02:24 - Mature Chips and Chiplets for AI Systems 05:23 - Integrated Process Package and System Optimization 08:18 - HBM and Chiplet Integration Challenges and Standards 11:16 - Photonics, Quantum Computing, and Thermal Management 14:06 - Balancing AI Packaging Capacity, Performance, and Cost 16:28 - Engineering Co-Packaged Optics for Future Bandwidth #theCUBE #GSAWomensLeadershipInitiative #theCUBEresearch #Intel #ASE #GlobalFoundries #AdvancedPackaging

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