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In this interview from SEMICON West 2026, Hardik Kabaria, co-founder and chief executive officer of Vinci4D, joins theCUBE's Christophe Bertrand to discuss how AI-trained physics models are compressing semiconductor design and validation cycles. Kabaria explains why Vinci built its platform around first-principles physics rather than customer data, training on 1 petabyte of simulation data to create a deterministic model that deploys behind a company's firewall. He details how the technology lets engineers run up to 100,000 design iterations in 24 hours, covering thermal, thermo-mechanical and warpage analysis across chips, packages and printed circuit boards. The conversation also explores Vinci's rapid funding trajectory, from a $10 million seed round backed by Khosla Ventures and Eclipse to a recent Series B that raised $250 million at a $1.5 billion valuation, co-led by Temasek and Advent with participation from AMD Ventures, Madrona and Applied Ventures. Kabaria details how the company's partnership with AMD closes the loop on "AI for AI," running physics inference on AMD's hardware to help engineer the next generation of chips, packages and 3D-stacked ICs. He also previews Vinci's expansion beyond semiconductors into space and satellite hardware, where extreme thermal environments and the absence of convective cooling demand new design-validation approaches with no room for after-the-fact fixes. From petabyte-scale training data to air-gapped deployments, Kabaria outlines a roadmap for how physics-grounded AI can keep pace with the speed of hardware innovation. Find more SiliconANGLE news and analysis https://siliconangle.com/ Follow theCUBE's wall-to-wall event coverage https://siliconangle.com/events/ Learn about the latest theCUBE events https://www.thecube.net/ 00:00 - Vinci's AI Physics Platform and Hardware Vision 04:13 - Hardware Design, Validation, and Thermal Management 07:13 - Hardware and Physics in AI System Design 10:23 - Vinci's Funding, Physics Models, and Training Data 13:19 - Secure Simulation and Space Hardware Innovation #theCUBE #SEMICONWest #theCUBEresearch #Vinci4D #AI #Semiconductors #AdvancedPackaging

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