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Siamak Tavallaei, Samsung | theCUBE + NYSE Wired: AI Data Pipeline Forum 2026 Analytics Table
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In this interview from the AI Data Pipeline Forum 2026 at the OCP Global Summit in San Jose, Siamak Tavallaei, senior principal engineer at Samsung, joins theCUBE's John Furrier to discuss how open standards are reshaping AI infrastructure from the chip level up. Tavallaei, a founding board member of the CXL Consortium, traces OCP's roots to 2016, when hyperscalers like Microsoft pushed for common hardware specifications to replace fragmented supplier interpretations. He explains how OCP functions as an integration layer, pulling in technologies developed through standards bodies such as JEDEC, PCIe and Ethernet and combining them with hardware, firmware and software into deployable systems. The conversation explores how accelerators have evolved from bolt-on offload cards into core functional elements of AI systems, raising the stakes for interoperability across the industry. Tavallaei describes OCP's contribution model as a win-win: suppliers gain access to multiple customers, while hyperscalers gain multiple sources for the same proven design. He notes that crisply defined specifications can cut integration time for a new hyperscale data center from a year or more down to just three to six months. Tavallaei also highlights his work on Composable Memory Systems, a Server Project subproject focused on standardizing how memory integrates into AI/ML infrastructure. From Microsoft's early "copy exact" philosophy to today's composable, modular hyperscale systems, Tavallaei makes the case that open collaboration remains the fastest path to scaling AI infrastructure. Find more SiliconANGLE news and analysis https://siliconangle.com/ Follow theCUBE's wall-to-wall event coverage https://siliconangle.com/events/ Learn about the latest theCUBE events https://www.thecube.net/ 00:00 - OCP Foundations and CXL Integration 02:13 - Consistent Hardware Specifications Across Suppliers 04:36 - AI Infrastructure Interoperability and Community Collaboration 06:48 - Open Standards and Composable Hyperscale Systems #theCUBE #AIDataPipelineForum #theCUBEresearch #NYSEWired #Samsung #OCP #AIInfrastructure
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